One of our activities is the full production of electronic cards in SMT technology. The quality of the production cycle is guaranteed by the new YAHAMA YCP-10 screen printing system and by PHILIPS Pick and Place machine, which are constantly updated to face any type of production requirement.
One of the strengths is undoubtedly the In-circuit testing SPEA FLYING PROBE, an innovative high- performance system for testing electronic boards using mobile probes, designed to test boards also made with SMT and fine pitch technologies. An advanced software, full of powerful tools, allows the generation, debugging and certification of functional programs.
The company is involved in the BGA component manufacturing process, succeeding in obtaining excellent results both for automatic assembly with Pick and Place machines and for rework out-line. The inspection of the correct manufacturing process of the aforementioned component is carried out through two possible processes: optical fiber and X-RAY. Verifications, interventions and tests are carried out by skilled and prepared personnel, made in an antistatic environment, supported by suitable equipment and advanced control instruments.
The company offers a complete product realization service: from the realization of the PCB to the functional tests, up to the final wiring with relative packaging and after-sales assistance.
Western CO. is able to manage both the defects created by the production lines, and those coming from the “Field”, or from the customer service centers.